Xiaomi 18 Fold arrives in September with Xring O3 chipset
Xiaomi’s next foldable smartphone will not be called the Xiaomi Mix Fold 5, but rather the Xiaomi 18 Fold. The company has officially confirmed this. The device will be unveiled in September. It will be the first to utilize Xiaomi’s new Xring O3 chipset, the successor to last year’s Xring O1.
The Xring O3 achieved 5,228,014 points in the AnTuTu V11 benchmark. That’s more than any other current smartphone chipset.
Xiaomi 18 Fold with two C1 Ultra cores with up to 4.35 GHz
The Xring O3 in the Xiaomi 18 Fold features a deca-core CPU with two C1 Ultra cores with a clock speed of up to 4.35 GHz, four C1 Premium cores with a clock speed of up to 3.68 GHz and four C1 Pro cores with a clock speed of up to 3.15 GHz.
In Geekbench 6.5, it achieves 3,945 points in the single-core test and 15,221 points in the multi-core test. The Apple A19 Pro still performs better in the single-core test, but is far behind the Xring O3 in the multi-core test.
In selected benchmarks, the GPU of the Xring O3 achieved results that were 85%, 94%, and 182% better than that of the Xring O1, which is used in the Xiaomi Pad 7S Pro and the Xiaomi 15S Pro, respectively. It also outperformed the Apple A19 Pro in all three tests published by Xiaomi. The Xring O3 supports LPDDR6 RAM with a bandwidth of 113.8 GB/s.
Looking at the benchmark tests of the Xiaomi 18 Fold with its self-developed chipset, the project seems to be slowly becoming a serious competitor for the best processors from Qualcomm, MediaTek and Apple.
