Samsung Exynos 2700 in Galaxy S27 series without WLP technology
According to a recent report, Samsung’s next flagship chipset, the Samsung Exynos 2700, could feature a new packaging design. The company reportedly plans to move away from fan-out wafer-level packaging (FOWLP) technology for the upcoming SoC.
The fan-out wafer-level packaging (FOWLP) that Samsung has used since the Exynos 2400 reportedly contributed to improved thermal performance. However, the technology was said to be less profitable for the company due to its complex and expensive manufacturing process.
Samsung Exynos 2700 with new architecture
According to a report citing an industry source, the Samsung Exynos 2700 chipset will introduce a new architecture called Side-by-Side (SbS). In this design, the application processor (AP) and DRAM are arranged side-by-side on the substrate, instead of being stacked on top of each other.
The company is also expected to integrate its Heat Pass Block (HPB) technology into the Exynos 2700, which could help improve heat dissipation and overall thermal efficiency.
Samsung is expected to use the Exynos 2700 in the Galaxy S27 and Galaxy S27+, both of which are expected to launch in early 2027. It will be interesting to see how the chipset’s new package design affects heat dissipation and overall efficiency.
