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News ticker: Huawei MatePad Pro 13.2, Honor 100 Pro, Google Pixel 8

The Huawei MatePad Pro 13.2 arrives on September 25th, the Honor 100 Pro in November and the Google Pixel 8 gets a Tensor G3 chip.
Huawei MatePad Pro 13.2

Huawei MatePad Pro 13.2 arrives on September 25th

Huawei is preparing to unveil a new tablet that could be the largest in the company’s history. The Huawei MatePad Pro 13.2 will launch in China on September 25th. Judging by the name and the teaser, it should have a huge 13.2-inch display.

The Huawei MatePad Pro 13.2 will also have very thin bezels. There will be both a magnetic keyboard and an M Pencil stylus as accessories. What will be part of the scope of delivery remains to be seen. The event will also provide the frame for the launch of the Huawei Watch Ultimate Gold Edition. The new version of the Huawei smartwatch has real 18k gold in the bezel, crown and gold PVD titanium strap. The market launch in Europe is in October at the proud price of 2,999 euros.


Honor 100 Pro is scheduled to launch in November

The Honor 90 series made its debut in China and then gradually expanded to Europe and India. The first technical data for the successor Honor 100 Pro are now slowly but surely appearing. Chinese tipster Digital Chat Station confirmed that the upcoming flagship should launch in November with a Snapdragon 8 Gen 2 chipset

The Honor 100 Pro has an AMOLED display with a resolution of 1,224 x 2,700 pixels, a refresh rate of 120 Hz and PWM dimming at 3,840 Hz. There is a centered punchhole for the front camera, which should shine with a fairly high resolution .

For reference, the China-exclusive Honor 90 Pro featured a 50-megapixel front camera. That’s pretty much alle about the Honor 100 series at the moment. We’ll let you know as soon as new leaks or official teasers appear.


Tensor G3 on the Google Pixel 8 runs cooler than the current G2 chipset

The Tensor G3 chipset, reportedly made by Samsung and based on the new Exynos 2400, could be the first Samsung foundry chip to feature fan-out wafer-level packaging (FO-WLP). This improved wafer-level packaging will theoretically offer greater efficiency and better graphics performance.

FO-WLP has already been used by Qualcomm and MediaTek. But this is reportedly the first time Samsung utilizes the technology. The 4nm Tensor G3 will power the Pixel 8 and Pixel 8 Pro and will have a 9 core CPU. In addition to a Cortex-X3 prime core, four Cortex-A715 and four Cortex-A510 cores are installed. A 10-core ARM Immortalis G715 GPU takes on graphics tasks instead of the previous 7-core G710.

The Google Pixel 8 series will be released on October 4th.


Thomas Dietrich
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