The Honor X50 will be unveiled on July 5, as the Chinese confirmed a few days ago. Today, a new leak and an official teaser from Honor with information on the chipset, battery capacity and storage options appeared on the Chinese social network Weibo. According to the leak, a Qualcomm Snapdragon 6 Gen 1 chipset will power it. The octa-core processor is based on a 4 Nm process and delivers a peak clock speed of 2.2 GHz.
According to the official Weibo page, Honor celebrates a decade of X-series products with the X50. Accordingly, Honor is dishing up a lot with the new model, including a display with curved 2.5D sides and a resolution of 2,652 x 1,200 pixels. Curved displays are usually rather rare to find in the mid-range.
In complete contrast to the large 5,800 mAh battery, which we unfortunately never get in the upper class. Despite the large capacity, the Honor smartphone will probably charge with a fast 66 watts, since the Honor X40 was already equipped with 40 watt SuperCharge. In addition, we already know that the Honor X50 will have 16 GB of RAM and 512 GB of storage. This would make it the Honor X model with the largest memory to date.
But that’s not all Honor has planned for the next month. Just a week after the arrival of the Honor X50, the Chinese company’s next foldable, the Honor Magic V2, will launch.